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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12521836 B1

PDFFull Text
Date of Patent:
Jan. 13, 2026

Filed:

Jan. 30, 2023

System and method for monitoring chemical mechanical polishing

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chih-Yu Wang, Taichung, TW;

Tien-Wen Wang, Hsinchu, TW;

In-Tsang Lin, Kaohsiung, TW;

Hsin-Hui Chou, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

STUDEBAKER BRACKETT PLLC

Primary Examiner:

Sylvia Macarthur

Int. Cl.
CPC ...
B24B 37/005 (2012.01); B24B 37/013 (2012.01); B24B 37/10 (2012.01); B24B 49/00 (2012.01); B24B 57/02 (2006.01); H01L 21/306 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B24B 37/0053 (2013.01); B24B 37/013 (2013.01); B24B 37/105 (2013.01); B24B 49/003 (2013.01); B24B 57/02 (2013.01); H01L 21/30625 (2013.01); H01L 21/67092 (2013.01); H01L 22/10 (2013.01); H01L 22/26 (2013.01); H01L 21/67288 (2013.01);
Abstract

An apparatus for chemical mechanical polishing of a wafer includes a process chamber and a rotatable platen disposed inside the process chamber. A polishing pad is disposed on the platen and a wafer carrier is disposed on the platen. A slurry supply port is configured to supply slurry on the platen. A process controller is configured to control operation of the apparatus. A set of microphones is disposed inside the process chamber. The set of microphones is arranged to detect sound in the process chamber during operation of the apparatus and transmit an electrical signal corresponding to the detected sound. A signal processor is configured to receive the electrical signal from the set of microphones, process the electrical signal to enable detection of an event during operation of the apparatus, and in response to detecting the event, transmit a feedback signal to the process controller. The process controller is further configured to receive the feedback signal and initiate an action based on the received feedback signal.

Find Patent Forward Citations

Wang, Chih-Yu. (2026). System and method for monitoring chemical mechanical polishing (U.S. Patent No. 12521836). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12521836

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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