The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Dec. 17, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Richard Geiger, Munich, DE;

Peter Baumgartner, Munich, DE;

Alexander Bechtold, Bavaria, DE;

Uwe Hodel, Putzbrunn, DE;

Richard Hudeczek, Munich, DE;

Walther Lutz, Erding, DE;

Carla Moran Guizan, Munich, DE;

Georgios Panagopoulos, Munich, DE;

Johannes Xaver Rauh, Munich, DE;

Roshini Sachithanandan, Bavaria, DE;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 84/03 (2025.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/535 (2006.01); H01L 23/60 (2006.01); H10D 84/01 (2025.01); H10D 84/85 (2025.01); H10D 89/60 (2025.01);
U.S. Cl.
CPC ...
H10D 84/038 (2025.01); H01L 23/5226 (2013.01); H01L 23/5286 (2013.01); H01L 23/535 (2013.01); H01L 23/60 (2013.01); H10D 84/0186 (2025.01); H10D 84/0193 (2025.01); H10D 84/853 (2025.01); H10D 89/60 (2025.01);
Abstract

IC devices including semiconductor devices isolated by BSRs are disclosed. An example IC device includes a first and a second semiconductor devices, a support structure, and a BSR. The BSR defines boundaries of a first and second section in the support structure. At least a portion of the first semiconductor device is in the first section, and at least a portion of the second semiconductor device is in the second section. The first semiconductor device is isolated from the second semiconductor device by the BSR. Signals from the first semiconductor device would not be transmitted to the second semiconductor device through the support structure. The BSR may be connected to a TSV or be biased. The IC device may include additional BSRs to isolate the first and second semiconductor devices. An BSR may be a power rail used for delivering power.


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