The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Aug. 17, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Min-Hsuan Lu, Hsinchu, TW;

Lin-Yu Huang, Hsinchu, TW;

Li-Zhen Yu, Hsinchu, TW;

Sheng-Tsung Wang, Hsinchu, TW;

Chung-Liang Cheng, Hsinchu, TW;

Huan-Chieh Su, Hsinchu, TW;

Chih-Hao Wang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/528 (2006.01); H10D 30/01 (2025.01); H10D 30/43 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 64/01 (2025.01); H10D 64/23 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/85 (2025.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H10D 30/014 (2025.01); H10D 30/43 (2025.01); H10D 30/6729 (2025.01); H10D 30/6735 (2025.01); H10D 30/6757 (2025.01); H10D 62/121 (2025.01); H10D 64/01 (2025.01); H10D 64/258 (2025.01); H10D 84/0167 (2025.01); H10D 84/017 (2025.01); H10D 84/0186 (2025.01); H10D 84/0188 (2025.01); H10D 84/038 (2025.01); H10D 84/85 (2025.01);
Abstract

A device includes a substrate, a vertical stack of nanostructure channels over the substrate, a gate structure wrapping around the nanostructure channels, and a source/drain region on the substrate. The device further includes a source/drain contact in contact with the source/drain region. The source/drain contact includes a core layer of a first material. A source/drain via is over and in contact with the source/drain contact. The source/drain via is the first material. A gate via is over and in electrical connection with the gate structure. The gate via is the first material.


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