Methods and structures for increasing stability of soft or organic features

Abstract

The present disclosure relates to methods and structures of increasing stability of soft or organic features. The methods disclosed herein may include lining soft/organic features with a lining material, depositing a lining material on the soft/organic features, or otherwise fabricating a lining structure. This provides mechanical support for the soft/organic features, thereby increasing stability of the soft/organic features. The methods, structures, and techniques described herein provide mechanical support for a soft/organic feature, thereby enabling better pattern transfer through semiconductor device fabrication processes, especially at reduced pitch and increased aspect ratio. A method for fabricating semiconductor devices may include spin-coating a patternable material on a substrate, patterning the patternable material to form a pattern including one or more protruding structures, and lining sidewalls of each of the one or more protruding structures with a silicon-containing material.