The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Dec. 14, 2021
Intel Corporation, Santa Clara, CA (US);
Carla Moran Guizan, Munich, DE;
Peter Baumgartner, Munich, DE;
Richard Geiger, Munich, DE;
Alexander Bechtold, Bavaria, DE;
Uwe Hodel, Putzbrunn, DE;
Richard Hudeczek, Munich, DE;
Walther Lutz, Erding, DE;
Georgios Panagopoulos, Munich, DE;
Johannes Xaver Rauh, Kirchseeon, DE;
Roshini Sachithanandan, Bavaria, DE;
Intel Corporation, Santa Clara, CA (US);
Abstract
IC devices including transmission lines are disclosed. An example IC device includes two electrically conductive layers (first and second layers) and a support structure between the two electrically conductive layers. The first layer is coupled to transistors over or at least partially in the support structure. A shield of a transmission is placed in the first layer. Conductors of the transmission line are placed in the second layer and are coupled to the first layer by TSVs. Another example IC device includes three electrically conductive layers (first, second, and third layers). The first layer is coupled to transistors over or at least partially in the support structure. A shield of a transmission line is placed in the second layer and conductors of the transmission line are placed in the third layer. The conductors are coupled to the first layer by TSVs and coupled to the second layer by vias.