The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Feb. 26, 2019
Tokyo Electron Limited, Tokyo, JP;
Nozomu Kanetake, Koshi, JP;
Akihiro Kubo, Koshi, JP;
Teruhiko Kodama, Koshi, JP;
Taro Yamamoto, Koshi, JP;
Yasushi Takiguchi, Koshi, JP;
Yoshiki Okamoto, Koshi, JP;
Hayato Hosaka, Koshi, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
A substrate warpage correction method according to this disclosure corrects warpage of a substrate without performing a process on a front surface of the substrate. The substrate warpage correction method includes a surface roughening of performing a surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate.