The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Mar. 04, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Leonard P. Guler, Hillsboro, OR (US);

Tsuan-Chung Chang, Portland, OR (US);

Charles H. Wallace, Portland, OR (US);

Peter P. Sun, Hillsboro, OR (US);

Tahir Ghani, Portland, OR (US);

Virupaxi Goornavar, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/67 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/83 (2025.01);
U.S. Cl.
CPC ...
H10D 30/6735 (2025.01); H10D 84/0151 (2025.01); H10D 84/038 (2025.01); H10D 84/83 (2025.01); H10D 30/6757 (2025.01);
Abstract

Techniques are provided herein to form an integrated circuit having gate cut structures or plug structures between source or drain regions, with an angled cut made to the top portion of the structures. In an example, a semiconductor device includes a semiconductor region extending between source and drain regions, and a gate structure extending over the semiconductor region. A gate cut structure is present adjacent to the semiconductor device and interrupts the gate structure. The gate cut structure has a first width along a first plane that extends through the semiconductor region and a second width along a second plane parallel to the first plane and above the semiconductor region, where the first width is greater than the second width. Similar angled plug structures may be provided adjacent to the source and drain regions to increase the landing area made to the metal contacts on the source and drain regions.


Find Patent Forward Citations

Loading…