The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Oct. 17, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Tsung-Sheng Kang, Ballston Lake, NY (US);
Koichi Motoyama, Clifton Park, NY (US);
Oscar Van Der Straten, Guilderland Center, NY (US);
Alexander Reznicek, Troy, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5286 (2013.01); H01L 21/76804 (2013.01); H01L 21/76831 (2013.01); H01L 23/5226 (2013.01); H01L 23/53295 (2013.01);
Abstract
A semiconductor structure includes a backside power rail disposed in a backside dielectric layer, and dielectric spacer layers laterally extending inwardly from opposing sidewalls of the backside dielectric layer and on a portion of a bottom surface of the backside power rail.