The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Dec. 30, 2021
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Ruilong Xie, Niskayuna, NY (US);
Oleg Gluschenkov, Tannersville, NY (US);
Yasir Sulehria, Niskayuna, NY (US);
Julien Frougier, Albany, NY (US);
Veeraraghavan S. Basker, Schenectady, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H10D 30/01 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 64/01 (2025.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76804 (2013.01); H01L 21/76879 (2013.01); H01L 23/5283 (2013.01); H10D 30/031 (2025.01); H10D 30/6713 (2025.01); H10D 30/6729 (2025.01); H10D 30/6735 (2025.01); H10D 62/118 (2025.01); H10D 64/01 (2025.01);
Abstract
A via connection layer for an electronic package and method for fabricating a via connection layer are provided. The via connection layer includes asymmetric via(s) formed in the via connection layer. The asymmetric via include a first sidewall with a first slope angle in a first direction and a second sidewall, where the second sidewall includes a second slope angle in the first direction.