The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
May. 17, 2024
Beijing E-town Semiconductor Technology Co., Ltd., Beijing, CN;
Mattson Technology, Inc., Fremont, CA (US);
Markus Lieberer, Augsburg, DE;
Christian Pfahler, Ulm, DE;
Markus Hagedorn, Ulm, DE;
Michael Vanabbema, Ulm, DE;
Alexandr Cosceev, Lonsee, DE;
Beijing E-Town Semiconductor Technology Co., Ltd., Beijing., CN;
Mattson Technology, Inc., Fremont, CA (US);
Abstract
Preheat processes for a millisecond anneal system are provided. In one example implementation, a preheat process can include receiving a substrate on a wafer support plate in a processing chamber of a millisecond anneal system; obtaining one or more temperature measurements of the wafer support plate using a temperature sensor; and applying a preheat recipe to heat the wafer support plate based at least in part on the temperature of the wafer support plate. In one example implementation, a preheat process can include obtaining one or more temperature measurements from a temperature sensor having a field of view of a wafer support plate in a millisecond anneal system; and applying a pulsed preheat recipe to heat the wafer support plate in the millisecond anneal system based at least in part on the one or more temperature measurements.