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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12476145 B1

PDFFull Text
Date of Patent:
Nov. 18, 2025

Filed:

Dec. 22, 2021

Self-aligned cut-metal layer method

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yu-Tse Lai, Hsinchu, TW;

Shih-Ming Chang, Hsinchu, TW;

Ya-Hui Chang, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Attorney:

Seed IP Law Group

Primary Examiner:

Younes Boulghassoul

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/3213 (2006.01); H01L 23/522 (2006.01); H10D 30/67 (2025.01); H01L 23/532 (2006.01); H10D 64/62 (2025.01);
U.S. Cl.
CPC ...
H01L 21/76897 (2013.01); H01L 23/5226 (2013.01); H10D 30/6729 (2025.01); H01L 21/32135 (2013.01); H01L 21/32139 (2013.01); H01L 23/53209 (2013.01); H01L 23/53257 (2013.01); H10D 30/6735 (2025.01); H10D 64/62 (2025.01);
Abstract

Methods of forming self-aligned vias and devices having self-aligned vias are provided. In some embodiments, a method includes forming a first via on a conductive layer. A mask is formed over the conductive layer, and the mask has an opening overlying a portion of the conductive layer and at least partially overlying the first via. A first line end of the conductive layer is formed by selectively removing the portion of the conductive layer, with the first via being aligned with the first line end of the conductive layer.

Find Patent Forward Citations

Lai, Yu-Tse. (2025). Self-aligned cut-metal layer method (U.S. Patent No. 12476145). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12476145

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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