The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Jul. 09, 2024
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Po-Yu Huang, Hsinchu, TW;

I-Wen Wu, Hsinchu, TW;

Chen-Ming Lee, Taoyuan County, TW;

Fu-Kai Yang, Hsinchu, TW;

Mei-Yun Wang, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 84/03 (2025.01); H10D 30/67 (2025.01); H10D 84/01 (2025.01);
U.S. Cl.
CPC ...
H10D 84/038 (2025.01); H10D 30/6735 (2025.01); H10D 30/6757 (2025.01); H10D 84/0149 (2025.01);
Abstract

A semiconductor structure includes a channel member, a gate structure disposed over the channel member, a source/drain feature connected to the channel member and adjacent to the gate structure, a source/drain contact disposed below and connected to the source/drain feature, a backside dielectric feature disposed below the channel member, and a first dielectric layer and a second dielectric layer disposed between the backside dielectric feature and the source/drain contact. The first dielectric layer includes a low-k dielectric material.


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