The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2025

Filed:

Jan. 12, 2024
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Shu-Han Chen, Hsinchu, TW;

Tsung-Ju Chen, Hsinchu, TW;

Ta-Hsiang Kung, New Taipei, TW;

Xiong-Fei Yu, Hsinchu, TW;

Chi On Chui, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/01 (2025.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 21/285 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); H10D 30/62 (2025.01); H10D 62/13 (2025.01); H10D 64/01 (2025.01); H10D 64/27 (2025.01); H10D 64/62 (2025.01); H10D 64/66 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01);
U.S. Cl.
CPC ...
H01L 21/28141 (2013.01); H01L 21/0234 (2013.01); H01L 21/28518 (2013.01); H01L 21/31055 (2013.01); H01L 21/31116 (2013.01); H10D 30/024 (2025.01); H10D 30/62 (2025.01); H10D 30/6211 (2025.01); H10D 30/6217 (2025.01); H10D 62/151 (2025.01); H10D 64/015 (2025.01); H10D 64/017 (2025.01); H10D 64/021 (2025.01); H10D 64/513 (2025.01); H10D 64/517 (2025.01); H10D 64/62 (2025.01); H10D 64/671 (2025.01); H10D 84/0142 (2025.01); H10D 84/0147 (2025.01); H10D 84/038 (2025.01);
Abstract

A method may include forming a dummy dielectric layer over a substrate, and forming a dummy gate over the dummy dielectric layer. The method may also include forming a first spacer adjacent the dummy gate, and removing the dummy gate to form a cavity, where the cavity is defined at least in part by the first spacer. The method may also include performing a plasma treatment on portions of the first spacer, where the plasma treatment causes a material composition of the portions of the first spacer to change from a first material composition to a second material composition. The method may also include etching the portions of the first spacer having the second material composition to remove the portions of the first spacer having the second material composition, and filling the cavity with conductive materials to form a gate structure.


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