The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Mar. 03, 2020
Applicants:

Kwansei Gakuin Educational Foundation, Hyogo, JP;

Toyota Tsusho Corporation, Nagoya, JP;

Inventors:

Tadaaki Kaneko, Hyogo, JP;

Natsuki Yoshida, Hyogo, JP;

Kazufumi Aoki, Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C30B 33/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02378 (2013.01); C30B 33/12 (2013.01); H01L 21/02595 (2013.01);
Abstract

A device for manufacturing a SiC substrate, in which formation of macro-step bunching is suppressed, comprises: a main body container that is capable of accommodating a SiC substrate and generates, by heating, a vapor pressure of gaseous species containing Si elements and gaseous species containing C elements, in an internal space; and a heating furnace that accommodates the main body container and performs heating so that a vapor pressure of the gaseous species containing Si elements is generated and a temperature gradient is formed, wherein the main body container has an etching space Sand a Si vapor supply source capable of supplying Si vapor into the main body container, the etching space Sbeing formed by making the SiC substrate face a portion of the main body container arranged on a lower-temperature side of the temperature gradient while the SiC substrate is disposed on a higher-temperature side of the temperature gradient.


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