The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Nov. 13, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Inventors:

Gulbagh Singh, Tainan, TW;

Po-Jen Wang, Taichung, TW;

Kun-Tsang Chuang, Miaoli, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); H01L 21/28 (2025.01); H01L 21/311 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H10D 64/01 (2025.01); H10D 64/23 (2025.01); H10D 64/66 (2025.01); H10B 10/00 (2023.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H10D 64/679 (2025.01); H01L 21/28141 (2013.01); H01L 21/31116 (2013.01); H10D 64/015 (2025.01); H10D 64/021 (2025.01); H10D 64/258 (2025.01); H10B 10/00 (2023.02); H10B 12/00 (2023.02);
Abstract

A transistor device and method of making the same are disclosed. The transistor device includes one or more air gaps in one or more sidewall spacers. The one or more air gaps may be located adjacent the gate and/or above the source or drain regions of the device. Various embodiments may include different combinations of air gaps formed in one or both sidewall spacers. Various embodiments may include air gaps formed in one or both sidewall spacers adjacent to the gate and/or above the source or drain regions of the device. The formation of the air gaps may reduce unwanted parasitic and/or fringing capacitance.


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