The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Apr. 03, 2024
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Isao Mori, Tokyo, JP;

Masaru Izawa, Tokyo, JP;

Naoki Yasui, Tokyo, JP;

Norihiko Ikeda, Tokyo, JP;

Kazuya Yamada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/3065 (2006.01); H05H 1/46 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32128 (2013.01); H01J 37/32183 (2013.01); H01J 37/32577 (2013.01); H01L 21/3065 (2013.01); H05H 1/46 (2013.01); H01J 2237/334 (2013.01);
Abstract

A plasma processing apparatus includes a processing chamber in which a sample is subjected to plasma processing, a first radio frequency power supply that supplies radio frequency power for generating plasma, a sample stage on which the sample is mounted, and a second radio frequency power supply that supplies radio frequency power to the sample stage, the plasma processing apparatus further includes a DC power supply that applies a DC voltage, that is changed according to a periodically repeated waveform, to the sample stage, and the waveform of one cycle has a period in which amplitude changes by a predetermined amount or more during a predetermined time. Accordingly, charged particles on a wafer surface are removed, a trench shape with high verticality can be obtained, and damage to a film that is not to be etched inside a trench can be reduced.


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