The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Jul. 28, 2022
Nxp B.v., Eindhoven, NL;
Tzu Ya Fang, Tainan, TW;
Yen-Chih Lin, Hsinchu, TW;
Jian Nian Chen, Kosiiung, TW;
Moly Lee, Kaohsiung, TW;
Yi Xiu Xie, Minxiong, TW;
Vanessa Wyn Jean Tan, Kuala Lumpur, MY;
Yao Jung Chang, Kaohsiung, TW;
Yi-Hsuan Tsai, Kaohsiung, TW;
Xiu Hong Shen, Kaosiung, TW;
Kuan Lin Huang, Changhua, TW;
NXP B.V., Eindhoven, NL;
Abstract
A method of manufacturing a semiconductor device is provided. The method includes placing a package substrate on a carrier substrate, forming a frame on the package substrate, and affixing an active side of a semiconductor die on the package substrate. The semiconductor die together with the frame and the package substrate form a cavity between the semiconductor die and the package substrate. At least a portion of the semiconductor die and the package substrate are encapsulated with an encapsulant. The frame is configured to prevent the encapsulant from entering the cavity.