Company Filing History:
Years Active: 2025
Title: Moly Lee - Innovator in Semiconductor Technology
Introduction
Moly Lee is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly with his innovative patent that addresses critical manufacturing processes.
Latest Patents
Moly Lee holds a patent for a "Semiconductor device with stress relief feature and method therefor." This invention provides a method of manufacturing a semiconductor device that includes placing a package substrate on a carrier substrate, forming a frame on the package substrate, and affixing an active side of a semiconductor die on the package substrate. The design creates a cavity between the semiconductor die and the package substrate, ensuring that at least a portion of both components is encapsulated with an encapsulant. Notably, the frame is configured to prevent the encapsulant from entering the cavity, enhancing the reliability of the semiconductor device.
Career Highlights
Moly Lee is currently employed at NXP B.V., a company known for its advancements in semiconductor solutions. His work at NXP B.V. has allowed him to further develop his expertise and contribute to innovative projects in the semiconductor industry.
Collaborations
Moly has collaborated with talented coworkers, including Tzu Ya Fang and Yen-Chih Lin, who share his passion for innovation in semiconductor technology.
Conclusion
Moly Lee's contributions to semiconductor technology through his patent and work at NXP B.V. highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of semiconductor manufacturing.