The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
May. 13, 2022
Ebara Corporation, Tokyo, JP;
Ebara Refrigeration Equipment & Systems Co., Ltd., Tokyo, JP;
Motoshi Kohaku, Tokyo, JP;
Yukihiro Fukusumi, Tokyo, JP;
Nobutaka Bannai, Tokyo, JP;
Hiromasa Miyata, Tokyo, JP;
Naoya Hanafusa, Tokyo, JP;
Ken Taoka, Tokyo, JP;
Kazutomo Miyazaki, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
EBARA REFRIGERATION EQUIPMENT & SYSTEMS CO., LTD., Tokyo, JP;
Abstract
A sub-fab area installation apparatus capable of reducing a power consumption used in manufacturing of semiconductors is disclosed. The sub-fab area installation apparatus includes: a vacuum pump configured to evacuate a processing gas from a processing chamber of the semiconductor manufacturing equipment; a cooling unit configured to cool a first circulation liquid used in the processing chamber; a heating unit configured to heat a second circulation liquid used in the processing chamber; an abatement device configured to detoxify the processing gas discharged from the vacuum pump; and a cooling-liquid line configured to pass a cooling liquid therethrough. The cooling liquid is supplied from a cooling source. The cooling-liquid line includes: a first downstream line, a second downstream line, and a third downstream line configured to supply the cooling liquid that has passed through the abatement device, the vacuum pump, and the cooling unit to the heating unit.