The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2025

Filed:

Feb. 28, 2023
Applicant:

Adeia Semiconductor Solutions Llc, San Jose, CA (US);

Inventors:

Veeraraghavan S. Basker, Schenectady, NY (US);

Kangguo Cheng, Schenectady, NY (US);

Theodorus E. Standaert, Clifton Park, NY (US);

Junli Wang, Slingerlands, NY (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/324 (2006.01); H10D 30/62 (2025.01); H10D 62/10 (2025.01); H10D 64/01 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/83 (2025.01);
U.S. Cl.
CPC ...
H10D 84/038 (2025.01); H01L 21/02636 (2013.01); H01L 21/30604 (2013.01); H01L 21/324 (2013.01); H01L 21/76224 (2013.01); H10D 30/62 (2025.01); H10D 30/6219 (2025.01); H10D 62/115 (2025.01); H10D 64/015 (2025.01); H10D 84/0151 (2025.01); H10D 84/0158 (2025.01); H10D 84/834 (2025.01);
Abstract

FinFET devices and processes to prevent fin or gate collapse (e.g., flopover) in finFET devices are provided. The method includes forming a first set of trenches in a semiconductor material and filling the first set of trenches with insulator material. The method further includes forming a second set of trenches in the semiconductor material, alternating with the first set of trenches that are filled. The second set of trenches form semiconductor structures which have a dimension of fin structures. The method further includes filling the second set of trenches with insulator material. The method further includes recessing the insulator material within the first set of trenches and the second set of trenches to form the fin structures.


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