The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2025

Filed:

Dec. 14, 2021
Applicant:

Wonik Ips Co., Ltd., Pyeongtaek-si, KR;

Inventors:

Ah Young Hwang, Pyeongtaek-si, KR;

Won Jun Jang, Seoul, KR;

Joo Suop Kim, Hwaseong-si, KR;

Kyung Park, Seoul, KR;

Jin Seo Kim, Seoul, KR;

Won Sik Ahn, Osan-si, KR;

Dae Seong Lee, Dongducheon-si, KR;

Chang Hun Kim, Osan-si, KR;

Assignee:

WONIK IPS CO., LTD., Pyeongtaek-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/44 (2006.01); C23C 14/56 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4408 (2013.01); C23C 14/564 (2013.01); C23C 16/4405 (2013.01); H01L 21/0228 (2013.01); H01L 21/0262 (2013.01); H01L 21/67248 (2013.01);
Abstract

The present invention relates to an internal chamber processing method, and more particularly, to an internal chamber processing method for performing processing on a chamber and a component inside the chamber. Disclosed is an internal chamber processing method for processing the inside of a chamber in which substrate processing is performed, the method including a pressurizing operation (S) of raising a pressure inside a chamber to a first pressure (P) higher than the atmospheric pressure by using a pressurized gas and a depressurizing operation of lowering the pressure inside the chamber from the first pressure (P) to a second pressure (P) after the pressurizing operation (S). The pressurizing operation (S) and the depressurizing operation (S) are performed in a state in which a substrate to be processed is removed from the inside of the chamber.


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