The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Aug. 26, 2022
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Chun-Liang Kuo, Kaohsiung, TW;

Yen-Hsing Chen, Taipei, TW;

Yen-Lun Chen, Miaoli County, TW;

Ruei-Hong Shen, Hsinchu, TW;

Tsung-Mu Yang, Tainan, TW;

Yu-Ren Wang, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/17 (2025.01); H10D 30/01 (2025.01); H10D 30/47 (2025.01); H10D 62/10 (2025.01); H10D 62/60 (2025.01); H10D 62/85 (2025.01); H10D 62/854 (2025.01);
U.S. Cl.
CPC ...
H10D 62/235 (2025.01); H10D 30/015 (2025.01); H10D 30/475 (2025.01);
Abstract

A method for fabricating a high electron mobility transistor (HEMT) includes the steps of forming a buffer layer on a substrate, forming a barrier layer on the buffer layer, forming a p-type semiconductor layer on the barrier layer, forming a gate electrode on the p-type semiconductor layer, and then forming a source electrode and a drain electrode adjacent to two sides of the gate electrode. Preferably, the buffer layer further includes a bottom portion having a first carbon concentration and a top portion having a second carbon concentration, in which the second carbon concentration is less than the first carbon concentration and a thickness of the bottom portion is less than a thickness of the top portion.


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