The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Sep. 23, 2022
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventors:

Yi Jiang, Hefei, CN;

Deyuan Xiao, Hefei, CN;

Weiping Bai, Hefei, CN;

Yunsong Qiu, Hefei, CN;

Guangsu Shao, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01); G11C 5/06 (2006.01);
U.S. Cl.
CPC ...
H10B 12/0335 (2023.02); G11C 5/063 (2013.01); H10B 12/05 (2023.02); H10B 12/315 (2023.02);
Abstract

The present disclosure provides a semiconductor structure and a manufacturing method thereof. The method of manufacturing a semiconductor structure includes: providing a base including a first region and a second region, where a plurality of active pillars are arranged at intervals in the base located in the first region; forming a first dielectric layer on the base, where the first dielectric layer covers the plurality of active pillars; forming a first mask layer with a first mask pattern on the first dielectric layer; forming a second mask layer with a second mask pattern on the first mask layer; forming a third mask layer with a third mask opening, where the third mask opening is used to expose the first region; and removing part of the first dielectric layer by using the first mask layer, the second mask layer, and the third mask layer as a mask.


Find Patent Forward Citations

Loading…