The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Aug. 28, 2021
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
A die stack includes: a first die including a first semiconductor substrate; a first redistribution layer (RDL) structure disposed on a front surface of the first die and electrically connected to the first semiconductor substrate; a second die bonded to the front surface of the first die and including a second semiconductor substrate; a third die bonded to the front surface of the first die and including a third semiconductor substrate; a second RDL structure disposed on front surfaces of the second and third dies and electrically connected to the second and third semiconductor substrates; and a through dielectric via (TDV) structure extending between the second and third dies and electrically connected to the first RDL structure and second RDL structure. The second and third dies are disposed in a plane that extends perpendicular to a vertical stacking direction of the die stack.