The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Apr. 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Jiun-Yi Wu, Taoyuan, TW;
Chien-Hsun Lee, Hsin-chu County, TW;
Chen-Hua Yu, Hsinchu, TW;
Chung-Shi Liu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
An electronic assembly includes a first wafer including a stack of alternating first dielectric layers and first circuit layers, a flexible structure including a second dielectric layer and a second circuit layer covered by the second dielectric layer, and a second wafer stacked upon the first wafer and including chip packages arranged in an array. The flexible structure includes a first region embedded in the first wafer and a second region connected to the first region and extending out from an edge of the first wafer. The chip packages are electrically coupled to the second circuit layer of the flexible structure through the first circuit layers of the first wafer.