The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Aug. 31, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Nicholas Anthony Lanzillo, Wynantskill, NY (US);
Ruilong Xie, Niskayuna, NY (US);
Lawrence A. Clevenger, Saratoga Springs, NY (US);
Hosadurga Shobha, Niskayuna, NY (US);
Huai Huang, Clifton Park, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5329 (2013.01); H01L 23/5226 (2013.01); H01L 23/5286 (2013.01); H01L 23/53228 (2013.01); H01L 23/53242 (2013.01);
Abstract
A semiconductor interconnect structure comprises a substrate, a plurality of metal lines disposed relative to the substrate and a plurality of first and second caps disposed on the metal lines wherein the first caps comprise a first dielectric material and the second caps comprise a second dielectric material different from the first dielectric material.