The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Jan. 16, 2025
Applicants:

Pnc Process Systems Co., Ltd., Shanghai, CN;

Ultron Semiconductor (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Yilin Shen, Shanghai, CN;

Xinlai Chen, Shanghai, CN;

Dawei Liu, Shanghai, CN;

Jie Wang, Shanghai, CN;

Zhengkai Lu, Shanghai, CN;

Ming Xu, Shanghai, CN;

Panpan Li, Shanghai, CN;

Fangyi Lv, Shanghai, CN;

Chuanlong Liu, Shanghai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B01F 23/40 (2022.01); B01F 23/45 (2022.01); B01F 25/4314 (2022.01); B01F 35/21 (2022.01); B01F 35/22 (2022.01); B01F 35/221 (2022.01); B01F 35/60 (2022.01); B01F 35/92 (2022.01); H01L 21/67 (2006.01); B01F 35/90 (2022.01); B01F 101/58 (2022.01);
U.S. Cl.
CPC ...
H01L 21/67057 (2013.01); B01F 23/45 (2022.01); B01F 23/48 (2022.01); B01F 23/49 (2022.01); B01F 25/43141 (2022.01); B01F 35/2113 (2022.01); B01F 35/2115 (2022.01); B01F 35/2132 (2022.01); B01F 35/2202 (2022.01); B01F 35/2217 (2022.01); B01F 35/602 (2022.01); B01F 35/92 (2022.01); B01F 2035/98 (2022.01); B01F 2035/99 (2022.01); B01F 2101/58 (2022.01);
Abstract

A liquid delivering system for wafer cleaning equipment includes an acid scouring tank, a sulfuric acid supplying source, a hydrogen peroxide supplying source, a first mixing device, a second mixing device and a feedback-control panel. The first mixing device and the second mixing device both includes a mixing duct, a multi-section mixing screw rod arranged inside the mixing duct and a heater wrapped around the mixing duct. By ways of adopting the above-mentioned technical solution, it is possible to realize fully mixing sulfuric acid with hydrogen peroxide in a mode of mixing in multi-stages, achieve precise control to temperature, and enable mixed liquid to fully react, thereby ensuring that the mixed liquid coming into the acid scouring tank meets cleaning requirements, and improving quality and efficiency of cleaning wafers.


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