The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2025
Filed:
Jun. 25, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Feras Eid, Chandler, AZ (US);
Adel Elsherbini, Tempe, AZ (US);
Johanna Swan, Scottsdale, AZ (US);
Shawna Liff, Scottsdale, AZ (US);
Aleksandar Aleksov, Chandler, AZ (US);
Julien Sebot, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H10D 88/00 (2025.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 21/50 (2013.01); H01L 24/95 (2013.01); H01L 25/0657 (2013.01); H10D 88/00 (2025.01);
Abstract
Hybrid bonded 3D die stacks with improved thermal performance, related apparatuses, systems, and methods of fabrication are disclosed. Such hybrid bonded 3D die stacks include multiple levels of dies including a level of the 3D die stack with one or more integrated circuit dies and one or more thermal dies both directly bonded to another level of the 3D die stack.