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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12319637 B1

PDFFull Text
Date of Patent:
Jun. 03, 2025

Filed:

Jun. 30, 2021

High purity ethylenediamine for semiconductor applications

Applicant:

Versum Materials Us, Llc, Allentown, PA (US);

Inventors:

Hareesh Thridandam, Carlsbad, CA (US);

Stuart H. Dimock, Lake Forest, CA (US);

Steven Gerard Mayorga, Oceanside, CA (US);

Ronald Martin Pearlstein, San Marcos, CA (US);

Assignee:

Versum Materials US, LLC, Tempe, AZ (US);

Attorneys:

Daniel Roth

Versum Materials US, LLC

Primary Examiner:

Ana Z Muresan

Int. Cl.
CPC ...
C07C 211/10 (2006.01); B01J 20/18 (2006.01); B01J 20/28 (2006.01); B08B 9/08 (2006.01); B65D 81/20 (2006.01); C07C 209/84 (2006.01); C07C 209/86 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C07C 211/10 (2013.01); B01J 20/18 (2013.01); B01J 20/2808 (2013.01); B08B 9/08 (2013.01); B65D 81/20 (2013.01); C07C 209/84 (2013.01); C07C 209/86 (2013.01); H01L 21/67017 (2013.01);
Abstract

A method for making the EDA that is suitable for use in thin-film semiconductor processing applications, are disclosed. The EDA is purified to remove water and trace metals. Water levels below about 50 ppm by weight are achieved by passing liquid through 3A type molecular sieve in a packed bed. Metallic impurities are removed by distillation and the resulting product is packaged in specially dried and optionally pre-conditioned containers.

Find Patent Forward Citations

Thridandam, Hareesh. (2025). High purity ethylenediamine for semiconductor applications (U.S. Patent No. 12319637). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12319637

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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