The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Jun. 19, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Takuya Mori, Tokyo, JP;

Tadashi Nishiyama, Koshi, JP;

Akiko Kiyotomi, Koshi, JP;

Hiroshi Tomita, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/38 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/34 (2006.01); G05B 19/042 (2006.01); H01L 21/67 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
G05B 19/042 (2013.01); G03F 7/20 (2013.01); G03F 7/34 (2013.01); G03F 7/38 (2013.01); H01L 21/67225 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G05B 2219/2602 (2013.01); H01L 21/027 (2013.01);
Abstract

This method includes, in a substrate treatment system, acquiring an image of a reference substrate which is a reference for condition setting; and acquiring an image of a treated substrate on which the predetermined treatment has been performed under a first treatment condition. A deviation amount in information between the image of the treated substrate and the image of the reference substrate is calculated. A correction amount of the treatment condition is calculated based on a correlation model indicating a correlation between a change amount in the information in the image of the treated substrate and a change amount in the treatment condition and on the deviation amount in the information. Also included is a setting of a second treatment condition based on the correction amount and a performing of the treatment on a target substrate based on the set second treatment condition.


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