The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Jul. 29, 2022
Applicant:

Invensas Bonding Technologies, Inc., San Jose, CA (US);

Inventors:

Belgacem Haba, Saratoga, CA (US);

Laura Wills Mirkarimi, Sunol, CA (US);

Christopher Aubuchon, San Jose, CA (US);

Rajesh Katkar, Milpitas, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/573 (2013.01); H01L 23/576 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/08146 (2013.01);
Abstract

A bonded structure with protective semiconductor elements including a semiconductor element with active circuitry and a protective element including an obstructive layer and/or a protective circuitry layer. The obstructive layer is configured to inhibit external access to at least a portion of the active circuitry. The protective circuitry layer is configured to detect or disrupt external access to the protective element and/or the active circuitry of the semiconductor element. The semiconductor element and the protective element are directly bonded without an adhesive along a bonding interface.


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