The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Jan. 15, 2025
University of Electronic Science and Technology of China, Sichuan, CN;
Zhuhai Yuexin Semiconductor Limited Liability Company, Guangdong, CN;
Xianming Chen, Guangdong, CN;
Yuanming Chen, Guangdong, CN;
Lei Feng, Guangdong, CN;
Benxia Huang, Guangdong, CN;
Yongzhi Zeng, Guangdong, CN;
Wei He, Guangdong, CN;
Yanlin Dong, Guangdong, CN;
University of Electronic Science and Technology of China, Sichuan, CN;
Zhuhai YUEXIN Semiconductor Limited Liability Company, Guangdong, CN;
Abstract
In a fabrication method for a package structure, a copper foil is provided, electroplating is performed on the copper foil to form a cavity sacrificial post, a dielectric material is laminated to form a dielectric layer, wherein an end face of the cavity sacrificial post is exposed to the dielectric layer, a wiring layer is formed on the dielectric layer, the cavity sacrificial post is removed by etching to form a through cavity, a bonding pad is formed on the wiring layer, a reverse side of a device is mounted on the copper foil in the through cavity, and a terminal of the device is wire-bonded with the bonding pad.