Yanlin Dong

Title: Yanlin Dong: Innovator in Semiconductor Packaging Technology

Introduction

Yanlin Dong is a prominent inventor based in Guangdong, China. He has made significant contributions to the field of semiconductor packaging technology. His innovative approaches have led to the development of new fabrication methods that enhance the efficiency and reliability of electronic devices.

Latest Patents

Yanlin Dong holds a patent for a "Fabrication method for package structure." This method involves several key steps, including providing a copper foil, performing electroplating to form a cavity sacrificial post, and laminating a dielectric material to create a dielectric layer. The process also includes forming a wiring layer, removing the cavity sacrificial post through etching, and mounting a device in the through cavity. This innovative method improves the overall performance of semiconductor packages.

Career Highlights

Throughout his career, Yanlin Dong has worked with notable institutions, including the University of Electronic Science and Technology of China. He has also been associated with Zhuhai Yuexin Semiconductor Limited Liability Company, where he has furthered his research and development efforts in semiconductor technologies.

Collaborations

Yanlin Dong has collaborated with esteemed colleagues, including Xianming Chen and Yuanming Chen. Their joint efforts have contributed to advancements in semiconductor packaging and related technologies.

Conclusion

Yanlin Dong's work in semiconductor packaging technology showcases his innovative spirit and dedication to advancing the field. His contributions, particularly through his patented methods, have the potential to significantly impact the electronics industry.