Yongzhi Zeng

Title: Yongzhi Zeng: Innovator in Semiconductor Packaging Technology

Introduction

Yongzhi Zeng is a notable inventor based in Guangdong, China. He has made significant contributions to the field of semiconductor packaging technology. His innovative approaches have led to advancements that enhance the efficiency and reliability of electronic devices.

Latest Patents

Yongzhi Zeng holds a patent for a fabrication method for a package structure. This method involves several key steps, including providing a copper foil, performing electroplating to form a cavity sacrificial post, and laminating a dielectric material to create a dielectric layer. The process also includes forming a wiring layer, removing the cavity sacrificial post through etching, and mounting a device on the copper foil. This innovative method improves the overall performance of semiconductor packages.

Career Highlights

Throughout his career, Yongzhi Zeng has worked with prominent organizations, including the University of Electronic Science and Technology of China and Zhuhai Yuexin Semiconductor Limited Liability Company. His experience in these institutions has allowed him to develop and refine his expertise in semiconductor technologies.

Collaborations

Yongzhi Zeng has collaborated with several professionals in his field, including Xianming Chen and Yuanming Chen. These collaborations have contributed to the advancement of semiconductor packaging techniques and have fostered innovation in the industry.

Conclusion

Yongzhi Zeng's contributions to semiconductor packaging technology through his innovative patent and collaborations highlight his role as a key inventor in the field. His work continues to influence the development of more efficient electronic devices.