The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2025
Filed:
Jul. 24, 2023
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Kelvin Tan Aik Boo, Singapore, SG;
Seng Kim Ye, Singapore, SG;
Chin Hui Chong, Singapore, SG;
Hong Wan Ng, Singapore, SG;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2022.12); H01L 23/00 (2005.12); H01L 23/498 (2005.12); H01L 25/00 (2005.12);
U.S. Cl.
CPC ...
H01L 25/0657 (2012.12); H01L 23/4985 (2012.12); H01L 24/48 (2012.12); H01L 25/50 (2012.12); H01L 2224/48147 (2012.12); H01L 2224/48227 (2012.12); H01L 2225/06506 (2012.12); H01L 2225/0651 (2012.12); H01L 2225/06562 (2012.12); H01L 2225/06572 (2012.12);
Abstract
A semiconductor device includes a rigid flex circuit that has a first rigid region and a second rigid region that are electrically connected by a flexible portion. A first die is mounted to a first side of the first rigid region. A second die is mounted to a second side of the second rigid region. The first and second sides are on opposite sides of the rigid flex circuit. The flexible portion is bent to hold the first and second rigid regions in generally vertical alignment with each other.