The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

May. 16, 2021
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Feng-Ching Chu, Hsinchu, TW;

Chung-Chi Wen, Hsinchu, TW;

Chia-Pin Lin, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2005.12); H10D 30/01 (2024.12); H10D 30/67 (2024.12); H10D 30/69 (2024.12); H10D 62/00 (2024.12); H10D 62/10 (2024.12); H10D 62/832 (2024.12); H10D 64/01 (2024.12);
U.S. Cl.
CPC ...
H10D 30/797 (2024.12); H01L 21/02532 (2012.12); H01L 21/0259 (2012.12); H10D 30/031 (2024.12); H10D 30/6713 (2024.12); H10D 30/6735 (2024.12); H10D 30/6757 (2024.12); H10D 62/021 (2024.12); H10D 62/118 (2024.12); H10D 62/832 (2024.12); H10D 64/017 (2024.12); H10D 64/018 (2024.12);
Abstract

The present disclosure provides a semiconductor device and a method of forming the same. A semiconductor device according one embodiment of the present disclosure include a plurality of channel members disposed over a substrate, a plurality of inner spacer features interleaving the plurality of channel members, a gate structure wrapping around each of the plurality of channel members, and a source/drain feature. The source/drain feature includes a first epitaxial layer in contact with the substrate and the plurality of channel members, and a second epitaxial layer in contact with the first epitaxial layer and the plurality of inner spacer features. The first epitaxial layer and the second epitaxial layer include silicon germanium. A germanium content of the second epitaxial layer is greater than a germanium content of the first epitaxial layer.


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