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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12261113 B1

PDFFull Text
Date of Patent:
Mar. 25, 2025

Filed:

Dec. 12, 2022

Middle-end-of-line strap for standard cell

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Meng-Hung Shen, Hsinchu County, TW;

Chih-Liang Chen, Hsinchu, TW;

Charles Chew-Yuen Young, Cupertino, CA (US);

Jiann-Tyng Tzeng, Hsinchu, TW;

Kam-Tou Sio, Hsinchu County, TW;

Wei-Cheng Lin, Taichung, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

Maschoff Brennan

Primary Examiner:

Victoria K Hall

Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 27/088 (2006.01); H01L 27/092 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 49/02 (2006.01); H01L 27/02 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/762 (2013.01); H01L 21/76877 (2013.01); H01L 21/76895 (2013.01); H01L 23/5226 (2013.01); H01L 27/0886 (2013.01); H01L 27/0924 (2013.01); H01L 28/00 (2013.01); H01L 29/42356 (2013.01); H01L 29/66795 (2013.01); H01L 23/5283 (2013.01); H01L 27/0207 (2013.01); H01L 29/785 (2013.01); H01L 2924/01029 (2013.01);
Abstract

A semiconductor structure includes a first conductive line, a first conductive segment, a second conductive segment, and a third conductive segment. The first conductive segment is electrically coupled to the first conductive line. The second conductive segment is electrically coupled the first conductive segment. The second conductive segment is disposed between the first conductive segment and the third conductive segment. A top surface of the first conductive segment is aligned with a top surface of the second conductive segment in a same layer.

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