The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Mar. 31, 2021
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chi-Hsing Lin, Hsinchu, TW;

Chen-Fon Chang, Hsinchu, TW;

Chun-Yi Wu, Hsinchu, TW;

Shi-Yu Ke, Hsinchu, TW;

Chih-Teng Liao, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/52 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32477 (2013.01); C23C 16/52 (2013.01); H01J 37/32972 (2013.01); H01L 21/67069 (2013.01); H01L 21/67253 (2013.01); H01L 22/20 (2013.01); H01J 2237/0225 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/2445 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01);
Abstract

Methods for revitalizing components of a plasma processing apparatus that includes a sensor for detecting a thickness or roughness of a peeling weakness layer on a protective surface coating of a plasma processing tool and/or for detecting airborne contaminants generated by such peeling weakness layer. The method includes detecting detrimental amounts of peeling weakness layer buildup or airborne concentration of atoms or molecules from the peeling weakness layer, and initiating a revitalization process that bead beats the peeling weakness layer to remove it from the component while maintaining the integrity of the protective surface coating.


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