The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

May. 23, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Shao-Ting Wu, Hsinchu, TW;

Meng-Sheng Chang, Hsinchu, TW;

Shao-Yu Chou, Hsinchu, TW;

Chung-I Huang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H10B 20/25 (2023.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); H10B 20/25 (2023.02); H01L 21/32139 (2013.01);
Abstract

A fusible structure includes: a metal line in a first metal layer extending along a first direction; and a first dummy structure disposed proximal to the metal line relative to a second direction, the second direction being perpendicular to the first direction, the first dummy structure being in a second metal layer. Relative to the first direction, the metal line includes first, second and third portions, the second portion being between the first portion and third portion. Relative to a third direction that is perpendicular to the first direction and the second direction, the first portion has a first thickness and the second portion has a second thickness, the first thickness being greater than the second thickness.


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