The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Jun. 22, 2020
Applicant:
Carnegie Mellon University, Pittsburgh, PA (US);
Inventors:
Lining Yao, Pittsburgh, PA (US);
Ye Tao, Pittsburgh, PA (US);
Yi-Chin Lee, Pittsburgh, PA (US);
Haolin Liu, Pittsburgh, PA (US);
Jianxun Cui, Pittsburgh, PA (US);
Catherine Mondoa, Pittsburgh, PA (US);
Jasio Santillan, Pittsburgh, PA (US);
Wen Wang, Pittsburgh, PA (US);
Teng Zhang, Syracuse, NY (US);
Assignee:
CARNEGIE MELLON UNIVERSITY, Pittsburgh, PA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 25/20 (2006.01); A21D 13/11 (2017.01); A21D 13/40 (2017.01); A21D 13/42 (2017.01); A21D 13/80 (2017.01); A23L 7/109 (2016.01); A23P 20/20 (2016.01); A23P 30/10 (2016.01); B29C 59/00 (2006.01); B32B 3/30 (2006.01); B32B 7/02 (2019.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 25/08 (2006.01); B32B 27/28 (2006.01); G06F 30/17 (2020.01); B29K 83/00 (2006.01);
U.S. Cl.
CPC ...
A23L 7/11 (2016.08); A21D 13/11 (2017.01); A21D 13/40 (2017.01); A21D 13/42 (2017.01); A21D 13/80 (2017.01); A23L 7/109 (2016.08); A23P 20/20 (2016.08); A23P 30/10 (2016.08); B29C 59/007 (2013.01); B32B 3/30 (2013.01); B32B 7/02 (2013.01); B32B 9/005 (2013.01); B32B 9/04 (2013.01); B32B 9/043 (2013.01); B32B 9/045 (2013.01); B32B 25/08 (2013.01); B32B 25/20 (2013.01); B32B 27/283 (2013.01); G06F 30/17 (2020.01); A23V 2002/00 (2013.01); B29K 2083/00 (2013.01); B32B 2307/732 (2013.01);
Abstract
Methods for creating self-folding materials that change shape in response to grooves created in the surface of the materials and when exposed to a stimuli. A tailored computational design tool, digital fabrication platform and mold for use with the methods also are provided.