The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Aug. 03, 2021
Applicant:

Ulvac, Inc., Kanagawa, JP;

Inventors:

Kenta Doi, Kanagawa, JP;

Toshiyuki Sakuishi, Kanagawa, JP;

Toshiyuki Nakamura, Kanagawa, JP;

Yasuhiro Morikawa, Kanagawa, JP;

Assignee:

ULVAC, Inc, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01J 37/32 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30655 (2013.01); H01J 37/32091 (2013.01); H01J 37/32816 (2013.01); H01L 21/3085 (2013.01); H01L 21/3086 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01); H01J 2237/335 (2013.01); H01L 21/3081 (2013.01);
Abstract

A silicon dry etching method of the invention, includes: preparing a silicon substrate; forming a mask pattern having an opening on the silicon substrate; forming a deposition layer on the silicon substrate in accordance with the mask pattern while introducing a first gas; carrying out a dry etching process with respect to the silicon substrate in accordance with the mask pattern while introducing a second gas, and thereby forming a recess pattern on a surface of the silicon substrate; and carrying out an ashing process with respect to the silicon substrate while introducing a third gas.


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