The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Oct. 07, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

David W. Overgaard, Boise, ID (US);

Andrew P. Lyle, Eagle, ID (US);

Glen E. Hush, Boise, ID (US);

Timothy P. Finkbeiner, Boise, ID (US);

Kristopher J. Kopel, Boise, ID (US);

Jonathan D. Harms, Meridian, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 29/12 (2006.01); G11C 29/56 (2006.01); G11C 29/04 (2006.01);
U.S. Cl.
CPC ...
G11C 29/12015 (2013.01); G11C 29/56004 (2013.01); G11C 2029/0403 (2013.01);
Abstract

Methods, systems, and devices for on-die testing for a memory device are described. In some examples, a memory die may include processing circuitry configured to perform evaluations of the memory die based on commands or instructions received from an external device. The processing circuitry may be configured to detect failures of the memory die and transmit related indications to the external device based on the on-die detection. In some examples, the processing circuitry may be configured to communicate failure information at a finer granularity than information associated with expected or nominal behavior. Additionally or alternatively, the processing circuitry may be configured to perform operations according to an internally-generated clock signal that operates at a faster rate or speed than a clock signal from the external device. In some examples, the processing circuitry may include an analog-to-digital conversion capability for digital communication of analog characteristics internal to the memory die.


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