The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Apr. 24, 2020
Applicants:

Kwansei Gakuin Educational Foundation, Hyogo, JP;

Toyota Tsusho Corporation, Nagoya, JP;

Inventor:

Tadaaki Kaneko, Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 23/06 (2006.01); C30B 29/36 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C30B 23/063 (2013.01); C30B 29/36 (2013.01); H01L 21/02378 (2013.01); H01L 21/02631 (2013.01);
Abstract

The purpose of the present invention is to provide a novel method and apparatus of manufacturing a semiconductor substrate. Achieved are a method of manufacturing a semiconductor substrate and a manufacturing apparatus therefor, the method comprising: an installation step for installing a plurality of objects to be processed having semiconductor substrates in a stack; and a heating step for heating each of the plurality of objects to be processed such that a temperature gradient is formed in the thickness direction of the semiconductor substrate.


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