The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Dec. 20, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Yu-Bey Wu, Hsinchu, TW;
Yen-Lian Lai, Hsinchu, TW;
Yung Feng Chang, Hsinchu, TW;
Jiun-Ming Kuo, Taipei, TW;
Yuan-Ching Peng, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
Integrated circuit (IC) chips and seal ring structures are provided. An IC chip according to the present disclosure includes a circuit region and a seal ring region surrounding the circuit region. The seal ring region includes a first active region extending lengthwise in a first direction and a first gate structure disposed on the first active region. The first gate structure extends lengthwise in a second direction that is tilted from the first direction. The first direction and the second direction form a tilted angle therebetween.