The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Jul. 28, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Gulbagh Singh, Hsinchu, TW;

Kun-Tsang Chuang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7824 (2013.01); H01L 29/1095 (2013.01); H01L 29/66681 (2013.01);
Abstract

A semiconductor structure includes a substrate assembly and a semiconductor device. The semiconductor device is formed on the substrate assembly, and includes a body region, two active regions, and a butted body. The active regions are disposed at two opposite sides of the body region, and both have a first type conductivity. The body region and the active regions together occupy on a surface region of the substrate assembly. The butted body has a second type conductivity different from the first type conductivity, and is located on the surface region of the substrate assembly so as to permit the body region to be tied to one of the active regions through the butted body.


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