The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Jan. 03, 2024
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Ming-Tung Wu, Hsinchu, TW;

Hsun-Chung Kuang, Hsinchu, TW;

Tung-He Chou, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B23K 26/03 (2006.01); B23K 26/53 (2014.01); B23K 103/00 (2006.01); H01L 21/268 (2006.01); H01L 21/304 (2006.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02021 (2013.01); B23K 26/032 (2013.01); B23K 26/53 (2015.10); H01L 21/268 (2013.01); H01L 21/3043 (2013.01); H01L 22/20 (2013.01); H01L 23/544 (2013.01); B23K 2103/56 (2018.08); H01L 2223/54426 (2013.01); H01L 2223/54493 (2013.01);
Abstract

In some embodiments, the present disclosure relates to an integrated chip fabrication device. The device includes a stealth laser apparatus arranged over a chuck configured to hold a substrate. An infrared camera is arranged over the chuck and configured to detect an alignment mark below the substrate. The alignment mark is used to align the stealth laser apparatus over the chuck. Control circuitry is configured to operate the stealth laser apparatus to form a stealth damage region at a location within the substrate that is determined based upon the alignment mark. The stealth damage region separates an inner region of the substrate from an outer region of the substrate.


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