The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Jan. 26, 2022
Tokyo Electron Limited, Tokyo, JP;
Iwatani Corporation, Osaka, JP;
Kazuya Dobashi, Nirasaki, JP;
Takehiko Orii, Nirasaki, JP;
Yukimasa Saito, Nirasaki, JP;
Kunihiko Koike, Hyogo, JP;
Takehiko Senoo, Hyogo, JP;
Koichi Izumi, Hyogo, JP;
Yu Yoshino, Hyogo, JP;
Tadashi Shojo, Hyogo, JP;
Keita Kanehira, Hyogo, JP;
TOKYO ELECTRON LIMITED, Tokyo, JP;
IWATANI CORPORATION, Osaka, JP;
Abstract
There is provided a gas cluster processing device for performing a predetermined process on a workpiece by irradiating the workpiece with a gas cluster, including: a processing container in which the workpiece is disposed; a gas supply part configured to supply a gas for generating the gas cluster; a flow rate controller configured to control a flow rate of the gas supplied from the gas supply part; a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion; and a pressure control part provided in a pipe between the flow rate controller and the cluster nozzle and including a back pressure controller configured to control a supply pressure of the gas for generating the gas cluster.