The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Jul. 02, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Koji Maeda, Nirasaki, JP;

Atsushi Shimada, Nirasaki, JP;

Katsushi Oikawa, Nirasaki, JP;

Tetsuya Miyashita, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C23C 14/35 (2006.01); C23C 14/52 (2006.01); C23C 14/54 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
C23C 14/352 (2013.01); C23C 14/3407 (2013.01); C23C 14/52 (2013.01); C23C 14/54 (2013.01); H01J 37/3405 (2013.01); H01J 37/3417 (2013.01); H01J 37/3423 (2013.01); H01J 37/3426 (2013.01); H01J 37/3452 (2013.01); H01J 37/3455 (2013.01); H01J 37/3482 (2013.01);
Abstract

A film forming apparatus includes a processing container, a substrate holder configured to hold a substrate inside the processing container, a cathode unit disposed above the substrate holder, and a gas introducing mechanism configured to introduce a plasma generating gas into the processing container. The cathode unit includes a target, a power supply configured to supply electric power to the target, a magnet provided on a rear side of the target, and a magnet driving part configured to drive the magnet. The magnet driving part includes an oscillation driver configured to oscillate the magnet along the target, and a perpendicular driver configured to drive the magnet in a direction perpendicular to a main surface of the target independently of driving performed by the oscillation driver. Sputtered particles are deposited on the substrate by magnetron sputtering.


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