The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2024

Filed:

Aug. 17, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Takashi Terada, Koshi, JP;

Yuji Mimura, Koshi, JP;

Hiroshi Maeda, Koshi, JP;

Kazutaka Noda, Koshi, JP;

Masaru Honda, Koshi, JP;

Ryoichi Sakamoto, Koshi, JP;

Yutaka Yamasaki, Koshi, JP;

Tatsuya Kitayama, Koshi, JP;

Akira Fukutomi, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); B32B 2457/14 (2013.01); Y10T 156/1126 (2015.01); Y10T 156/1933 (2015.01);
Abstract

A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.


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