The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Dec. 13, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Choonghyun Lee, Chigasaki, JP;

Takashi Ando, Eastchester, NY (US);

Jingyun Zhang, Albany, NY (US);

Alexander Reznicek, Troy, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 10/00 (2023.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H10B 10/125 (2023.02); H01L 29/0649 (2013.01); H01L 29/0665 (2013.01); H01L 29/42392 (2013.01); H01L 29/78696 (2013.01);
Abstract

A semiconductor device is provided. The semiconductor device includes a first device including a first nanosheet stack formed on a substrate, the first nanosheet stack including alternating layers of a first work function metal (WFM) gate layer and an active semiconductor layer, a second nanosheet stack formed on the substrate, the second nanosheet stack including alternating layers of a second WFM gate layer and the active semiconductor layer, a shallow trench isolation (STI) region formed in the substrate between the first nanosheet stack and the second nanosheet stack, and an STI divot formed in the STI region. The first WFM gate layer of the first nanosheet stack is formed in the STI divot.


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